Oxford Instruments (LON:OXIG) Hits New 52-Week Low – What’s Next?

Oxford Instruments plc (LON:OXIG)’s share price hit a new 52-week low during mid-day trading on Thursday . The company traded as low as GBX 1,870 ($23.44) and last traded at GBX 1,870 ($23.44), with a volume of 5911 shares traded. The stock had previously closed at GBX 1,950 ($24.45).

Analyst Upgrades and Downgrades

Several brokerages have recently issued reports on OXIG. Berenberg Bank lowered their price target on Oxford Instruments from GBX 2,925 ($36.67) to GBX 2,830 ($35.48) and set a “buy” rating on the stock in a research report on Tuesday, November 12th. Shore Capital reaffirmed a “buy” rating on shares of Oxford Instruments in a report on Wednesday, October 16th.

Oxford Instruments Price Performance

The company has a market cap of £1.21 billion, a price-to-earnings ratio of 2,406.98, a PEG ratio of -3.56 and a beta of 0.96. The company has a quick ratio of 1.11, a current ratio of 1.64 and a debt-to-equity ratio of 12.96. The company’s fifty day moving average price is GBX 2,082.13 and its two-hundred day moving average price is GBX 2,298.03.

Oxford Instruments Cuts Dividend

The company also recently declared a dividend, which will be paid on Friday, January 10th. Shareholders of record on Thursday, November 28th will be paid a GBX 5.10 ($0.06) dividend. This represents a yield of 0.24%. The ex-dividend date is Thursday, November 28th. Oxford Instruments’s dividend payout ratio is currently 2,441.86%.

About Oxford Instruments

Oxford Instruments plc provide scientific technology products and services for academic and commercial organizations worldwide. It operates through three segments: Materials & Characterisation, Research & Discovery, and Service & Healthcare. The company offers atomic force, electron, and Raman microscopy; deposition tools comprising plasma enhanced chemical vapour deposition, chemical vapour deposition, inductively coupled plasma chemical vapour deposition, atomic layer deposition, and ion beam deposition systems; and etch tools, including inductively coupled plasma etching, reactive ion etching, deep silicon etching, atomic layer etching, and ion beam etching systems.