ChipMOS TECHNOLOGIES (NASDAQ:IMOS) Stock Rating Lowered by StockNews.com

ChipMOS TECHNOLOGIES (NASDAQ:IMOS) was downgraded by equities researchers at StockNews.com from a “buy” rating to a “hold” rating in a research report issued on Tuesday.

ChipMOS TECHNOLOGIES Stock Performance

ChipMOS TECHNOLOGIES stock opened at $18.24 on Tuesday. The firm has a fifty day simple moving average of $19.08 and a two-hundred day simple moving average of $21.81. The company has a quick ratio of 2.72, a current ratio of 3.07 and a debt-to-equity ratio of 0.49. ChipMOS TECHNOLOGIES has a twelve month low of $17.70 and a twelve month high of $32.19. The company has a market capitalization of $663.21 million, a PE ratio of 12.76 and a beta of 0.86.

ChipMOS TECHNOLOGIES (NASDAQ:IMOS) last released its earnings results on Tuesday, November 5th. The semiconductor company reported $0.26 earnings per share for the quarter. ChipMOS TECHNOLOGIES had a return on equity of 6.66% and a net margin of 7.25%. The company had revenue of $191.70 million during the quarter.

Institutional Inflows and Outflows

An institutional investor recently raised its position in ChipMOS TECHNOLOGIES stock. Ballentine Partners LLC raised its position in ChipMOS TECHNOLOGIES INC. (NASDAQ:IMOS) by 20.2% during the third quarter, according to its most recent disclosure with the Securities and Exchange Commission. The firm owned 15,547 shares of the semiconductor company’s stock after acquiring an additional 2,611 shares during the quarter. Ballentine Partners LLC’s holdings in ChipMOS TECHNOLOGIES were worth $364,000 at the end of the most recent quarter. Institutional investors own 7.39% of the company’s stock.

ChipMOS TECHNOLOGIES Company Profile

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in the People’s Republic of China, Taiwan, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and Other Display Panel Driver Semiconductors; Bumping; and Others segments.